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嵌入式存储芯片


全系列产品适配各类应用场景

高速大容量的移动存储解决方案

  • Nand Flash

    Memory chips supporting multiple wafers

    Follow JEDEC JESD230C international standard, standard package 132/252-ball BGA, support 32GB~1TB capacity segment, and support the original mainstream wafer. It can package 1-16 wafers in one particle. Products are divided into single channel, double channels and four channels. Single channel and dual channel Nand is suitable for U disk and SSD; Four-channel Nand is suitable for M.2 2230 SSD product.


    Solid State Drive

    SSD

    Data center

    USB Flash Drives

    系统盘

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