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嵌入式存储芯片


全系列产品适配各类应用场景

高速大容量的移动存储解决方案

  • eSSD

    High stability and high integrated mass storage eSSD

    Compliance with SATA3.0 standard, adopt SATAIII 6.0Gbps interface, compatible with 6.0Gbps /3.0Gbps/1.5 Gbps,

    The package size of 314-ball BGA is 30.0 mm * 40.0 mm * 3.0 mm. The chip adopts SIP technology and supports 256 GB ~ 1 TB capacity .

    The package size of 104-ball BGA is 14.0 mm * 18.0 mm * 1.8 mm. The chip adopts multi wafer packaging technology and supports 32 GB ~ 128 GB capacity. Compared with  traditional SSD, the size of eSSD is smaller, the single chip capacity is larger, and the reliability is higher.Its compact size is to reduce the equipment loading and enables design more flexible.


    Rugged laptop

    Drone

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