Ultra high density stacking and excellent mobile performance
UFS-based multi-chip packages, using ultra-fast universal flash memory UFS2.2 controller, provide powerful performance and low-power consumption for smart phone design. Support LPDDR4X 32Gb~64Gb and UFS 128GB~512GB. UMCP combines LPDDR and UFS with high performance and large capacity. Compared with PoP + discrete UFS, it takes up 40% less space. It’s smaller, space-saving, higher speed, low latency, large capacity, high data transmission rate and better data security.
Mobile phone
Tablet PC
Wearable Smart Devices
Drone
2024,07,02
近日,时创意受邀出席第八届集微半导体大会,就技术创新、企业投融资、知识产权等主题,与海内外院士专家、企业家及投资代表一道,洞察存储“芯”风向,为产业可持续发展贡献智慧和力量。
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2024,07,02
近日,时创意在2024 MWC上海中全面展现从5G+到AI+多场景高效能存储解决方案,以存储技术、数智创新助力万物互联。时创意以存储创造的美好生活,正在进行时!
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2024,06,21
盛夏6月,时创意整装待发,即将奔赴上海MWC、深圳 SEMI-e以及厦门集微半导体三大行业盛会,展示最新产品与技术创新成果。芯之所向、路之所往,我们在这里等你~
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