Ultra high density stacking and excellent mobile performance
UFS-based multi-chip packages, using ultra-fast universal flash memory UFS2.2 controller, provide powerful performance and low-power consumption for smart phone design. Support LPDDR4X 32Gb~64Gb and UFS 128GB~512GB. UMCP combines LPDDR and UFS with high performance and large capacity. Compared with PoP + discrete UFS, it takes up 40% less space. It’s smaller, space-saving, higher speed, low latency, large capacity, high data transmission rate and better data security.
Mobile phone
Tablet PC
Wearable Smart Devices
Drone
2024,03,22
3月20日,时创意受邀出席CFMS2024中国闪存市场峰会,围绕生成式AI、智能汽车等焦点市场存储应用创新及QLC技术全场景应用进行深度探讨交流,并同期展示了公司在存储方案布局、技术策略及智造部署方面的进展情况。
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2024,03,15
3月20日,时创意将受邀出席CFMS2024闪存市场峰会,全面展示在研发创新、智能制造及质量管控方面的丰硕成果。峰会期间,时创意在会场设有企业家会客厅,邀您预约莅临,共同探讨产业热点,展望发展新趋势~
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2024,03,11
时创意期待你的加入!
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