High stability and high integrated mass storage eSSD
Compliance with SATA3.0 standard, adopt SATAIII 6.0Gbps interface, compatible with 6.0Gbps /3.0Gbps/1.5 Gbps,
The package size of 314-ball BGA is 30.0 mm * 40.0 mm * 3.0 mm. The chip adopts SIP technology and supports 256 GB ~ 1 TB capacity .
The package size of 104-ball BGA is 14.0 mm * 18.0 mm * 1.8 mm. The chip adopts multi wafer packaging technology and supports 32 GB ~ 128 GB capacity. Compared with traditional SSD, the size of eSSD is smaller, the single chip capacity is larger, and the reliability is higher.Its compact size is to reduce the equipment loading and enables design more flexible.
Rugged laptop
Drone
2024,04,27
4月24至26日,为期三天的JAPAN IT WEEK2024 SPRING在东京Big Sight隆重举行。时创意携SSD固态硬盘、DRAM内存模组、嵌入式存储芯片及移动存储等全系列产品及技术解决方案精彩亮相,以突出的产品力、先进智造工艺及高品质服务等硬核实力赢得众多观展嘉宾的高度赞誉。
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2024,04,10
樱花烂漫时,时创意SCY邀您共赴Japan IT Week2024 Spring,届时将分享存储前沿创新技术及解决方案,为您匹配高附加值、高性价比的存储产品及高品质服务,敬请期待~
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2024,03,22
3月20日,时创意受邀出席CFMS2024中国闪存市场峰会,围绕生成式AI、智能汽车等焦点市场存储应用创新及QLC技术全场景应用进行深度探讨交流,并同期展示了公司在存储方案布局、技术策略及智造部署方面的进展情况。
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